UPC: 9780070366084 | Ball Grid Array Technology (Hardcover) by John H Lau

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UPC: 9780070366084 | Ball Grid Array Technology (Hardcover) by John H Lau

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UPC lookup results for: 9780070366084 | Ball Grid Array Technology (Hardcover) by John H Lau

Hard cover. Language: English. Pages: 636. Sewn binding. Cloth over boards. 636 p. Electronic Packaging & Interconnection Series. This text covers ball grid array (BGA) design and manufacturing. BGA is a relatively new way of connecting leads from an integrated circuit package to a printed circuit board allowing a higher pin count and function density than other connection methods and giving the lowest signal delay. These features make it an important component of modern high performance systems but the density of leads makes manufacturing and process control very difficult.